PI Advanced Materials, an Arkema Affiliate, has received the 2026 KPCA Industry award for contributions to the world’s first mass-production for 4µm ultra-thin polyimide film using an unstretched process. The 4µm polyimide film achieved comparable mechanical, thermal and adhesion performance at approximately one-third the thickness of conventional 12.5µm polyimide film.
Sanghak Lee, Gumi Production Team Leader at PI Advanced Materials, received the “2026 KPCA Proud PCB & Semiconductor Packaging Industry Award” in recognition of his contribution to the development of the world’s first mass-production technology for 4㎛ ultra-thin polyimide (PI) film using an unstretched process.
The award ceremony was held on September 9 at Gyeongwonjae, Incheon. The award recognizes PI Advanced Materials’ world-class technological capabilities in ultra-thin polyimide film and its contribution to the advancement of the materials industry.
Drawing on PI Advanced Materials’ extensive expertise in polymerization, film casting, and winding technologies, Sanghak Lee played a key role in establishing the core technologies required for the mass production of ultra-thin PI film. In particular, he led the optimization of the T-DIE-based film casting process and the development of precise process control technologies, overcoming key technical challenges and enabling the successful commercialization of the world’s first 4㎛ ultra-thin PI film produced through an unstretched process in 2024.
PI Advanced Materials’ 4㎛ ultra-thin PI film is approximately one-third the thickness of the 12.5㎛ PI film widely used in the industry, while maintaining comparable mechanical and thermal properties as well as adhesion performance. The film also offers excellent thickness uniformity and low, consistent loop stiffness, enhancing processability and expanding its potential for a wide range of applications.
The technology can support increasingly demanding requirements for lighter, thinner, and higher-performance products across a range of advanced industries, including flexible printed circuit boards (FPCBs), displays, semiconductor packaging, and electric vehicle batteries.
Building on its successful mass production of 5㎛ PI film, PI Advanced Materials has further demonstrated its world-class technological capabilities in ultra-thin polyimide film through the production of the world’s first 4㎛ product.
PI Advanced Materials will continue to support customers in developing high-value-added products through differentiated material technologies and continuous R&D, while further strengthening its competitiveness in the global advanced materials market.