Zenimid™ Polyimide (PI) Film
Polyimide Film: The Backbone of New Technology
Polyimide films are crucial across diverse applications, ranging from Flexible Printed Circuit Boards (FPCB) to cutting-edge thermal management technologies. As smart devices evolve towards slimmer, more integrated designs, the flexibility and dependability of Zenimid™ Polyimide film has become essential. It enables high-efficiency compact circuits in FPCBs, offers superior thermal conductivity in graphite sheets, and guarantees safety and performance in rechargeable batteries for electric vehicles, marking it as a central element in technological innovation.
Leading the Charge in 5G and Flexible Displays
Modified Polyimide Film (MPI) is essential for minimizing transmission loss in high-speed communications, enhancing 5G antenna performance and supporting seamless data transmission. As the industry shifts towards higher resolution displays and foldable devices, Zenimid™ Polyimide film emerges as a benchmark, providing exceptional solutions for Chip on Film (CoF) applications and more.
A Spectrum of Solutions with Zenimid™ Polyimide Film
The range of Zenimid™ Polyimide films available caters to a variety of applications such as Flexible Printed Circuits (FPC), high-temperature insulation, and graphite sheets. We provide the broadest film portfolio commercially available, ranging from 4 microns (a unique product worldwide) to more than 160 microns and up to 2,060 mm width. Each product is carefully engineered to offer outstanding mechanical and electrical properties, as well as dimensional stability, ensuring unparalleled reliability across all applications. From flexible displays and electric vehicles to aerospace, polyimide films offer the versatility and performance demanded by today’s industries.
Zenimid™ Polyimide Film Properties
Polyimide (PI) films are essential for new technology applications that require the highest performing material for the flexible PCB, graphite sheet, rechargeable battery insulation, 5G technology, and displays. We guarantee stable supply and the highest quality PI films thanks to cutting-edge R&D and production facilities.
Zenimid™ Polyimide Film - General brochure
This brochure introduces Zenimid™, the advanced polyimide film portfolio. Built on decades of innovation, our polyimide technologies deliver outstanding thermal stability, mechanical strength, and electrical insulation, enabling next-generation applications across electronics, semiconductors, and emerging industries.
From flexible printed circuits and wearable devices to EV motor insulation and flexible displays, Zenimid™ films are designed to meet the evolving demands of miniaturization, high reliability, and advanced functionality.
his guide provides an overview of our comprehensive product lineup—including amber, black, and high-modulus PI films—along with key properties and applications.
Zenimid™ Polyimide Film - General brochure
This brochure presents the Zenimid™ GF polyimide film family, a high-performance solution, designed to meet the demanding requirements of advanced electronics and flexible circuit applications.
The Zenimid™ GF range is specifically engineered to support Flexible Printed Circuit (FPC) technologies, offering optimized thermal expansion matched to copper, along with reliable mechanical and electrical performance across a wide range of thicknesses.
This document provides a comprehensive overview of the GF family’s key properties, including mechanical, thermal, electrical, surface, and optical characteristics, enabling informed material selection for high-reliability and next-generation applications.
The World’s First Ultra-Thin Polyimide Film at Just 4 Micrometers (μm)
PI Advanced Materials, an Arkema Affiliate, announced the successful launch of the world's first non-stretched ultra-thin polyimide film with a thickness of 4 micrometers (μm).
While most polyimide films are produced in thicknesses ranging from 12.5 to 25 micrometers, PI Advanced Materials stands out as the only manufacturer worldwide offering a 4-micrometer polyimide film produced by a non-stretching process.
Read the full news on ultra-thin film launch here
Zenimid™ Polyimide film’s key properties:
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Advanced thermal properties |
Dimensional stability
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Electrical properties |
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PI films can withstand extreme temperatures ranging from near absolute zero to 400°C and can adapt to the most demanding manufacturing processes or ultimate use conditions. |
PI films are extremely isotropic and retain their original shape and form over a wide temperature range in both directions. Some of our films are specially engineered to minimize CLTE (Coefficient of Linear Thermal Expansion) so as to match that of copper, a key requirement for the FPCB industry. |
PI films are excellent electrical insulators that can be used in high-voltage environments in electronic devices for stability and electrical conductors for insulation. |
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Flexibility |
Extreme fire resistance |
Chemical resistance
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Due to their excellent bendability and dimensional stability, PI films are suitable for flexible/foldable applications and afford flexibility in PCB design. |
PI films are halogen-free and intrinsically flame retardant. Our films further display an excellent FST (Flame, Smoke and Toxicity) behavior required for AAD (Aeronautics Aerospace and Defense) applications. |
PI films display an all-around excellent chemical resistance to a variety of chemicals. |
Zenimid™ Polyimide Tapes & Labels
Zenimid™ polyimide, an ultra-high-performance polyimide film engineered for demanding tapes & labels applications, offers enhanced thermal stability, mechanical strength, and processability.
Polyimide tape is used in a variety of advanced applications, including battery manufacturing, semiconductor packaging, PCB manufacturing, and cable and wire insulation.
Learn more about polyimide tapes & labels
