PLATAMID® HX 2620 POWDER
Copolyamide powder
Product overview
PLATAMID® HX 2620 POWDER is a thermoplastic copolyamide hot melt adhesive. This low melt viscosity grade is used to manufacture fusible interlinings. It offers good laundry resistance and good steam resistance at low/medium fusing conditions
This product is available in different grain sizes:
- PA80 (0-80 µm paste dot)
- PRA 170 (0-170 µm double dot)
Geographic availability
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Worldwide
| Transformation Processes | Scattering, paste, double dot |
| Melt volume flow rate (MVR), cm3/10min | 41.5 |
| Melting temperature (DSC @ 10°C/min), °C | 124 |