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Zenimid Polyimide Advanced Materials

Product overview
Zenimid™ Polyimide is the material engineered to perform in the most demanding environments, offering exceptional dimensional stability, flexibility, heat resistance, chemical resistance, and electrical insulation. The material is available in film, varnish and stock shape, and some applications include FPCBs and graphite sheet in smart devices, battery management systems (BMS), and 5G infrastructure.
Geographic availability
  • Oceania
  • Africa
  • Asia Pacific
  • Latin America and the Caribbean
  • Middle East
  • Europe
  • North America

Latest news

Dec 08 2025
  • Products
PI Advanced Materials Receives Ministerial Award at 2025 Korea Technology Awards
 ▪️ Recognized for Korea’s first domestic mass production of high-reliability polyimide ...
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PI AM CTO at the Ministerial Award 2025.jpg
PI AM CTO at the Ministerial Award 2025.jpg

 Zenimid™ Polyimide: engineered for extreme performance, today and tomorrow

Zenimid™ is engineered to reliably perform in any environment. Polyimide (PI) is a unique family of ultra-high-temperature polymers containing imide linkage. PI has gained recognition for its material performance properties required for the highest demanding environments such as dimensional stability, heat resistance, chemical resistance, and electrical insulation. PI can withstand extreme temperatures ranging from near -270℃ to above 400 ℃. Polyimide plays a crucial role in the electronics and aerospace industry because of its dimensional stability, electrical properties, and flexibility. By integrating advanced polyimide materials into their core, industries are accelerating into the future, crafting technologies that not only meet but anticipate the demands of tomorrow.

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