PLATAMID® HX 2667 POWDER
Copolyamide powder
製品の概要
PLATAMID® HX 2667 POWDER is a thermoplastic copolyamide hot melt adhesive. This medium melt viscosity grade is suitable for manufacturing of of of fusible interlinings. It offers an excellent laundry resistance up to 60°C and an excellent resistance to all kind of steam treatment.
This product is available in different grain sizes:
- PA80 (0-80 µm paste dot)
- PTA 170/20 (0-170 µm power dot)
- PTA 170 (80-170 µm double dot)
地理的条件
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世界的
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TDS（テクニカルデータシート）
| Transformation Processes | Scattering, paste, double dot |
| Melt volume flow rate (MVR), cm3/10min | 30 |
| Melting temperature (DSC @ 10°C/min), °C | 128 |