PLATAMID® HX 2667 POWDER
Copolyamide powder
제품 개요
PLATAMID® HX 2667 POWDER is a thermoplastic copolyamide hot melt adhesive. This medium melt viscosity grade is suitable for manufacturing of of of fusible interlinings. It offers an excellent laundry resistance up to 60°C and an excellent resistance to all kind of steam treatment.
This product is available in different grain sizes:
- PA80 (0-80 µm paste dot)
- PTA 170/20 (0-170 µm power dot)
- PTA 170 (80-170 µm double dot)
이용 가능 지역
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전 세계
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TDS
| 가공 공정 | 분산, 페이스트, 더블 닷 |
| 용융부피지수(MVR) (cm3/10min) | 30 |
| 용융 온도 (°C) (DSC, 10°C/min) | 128 |