PLATAMID® HX 2620 POWDER
Copolyamide powder
제품 개요
PLATAMID® HX 2620 POWDER is a thermoplastic copolyamide hot melt adhesive. This low melt viscosity grade is used to manufacture fusible interlinings. It offers good laundry resistance and good steam resistance at low/medium fusing conditions
This product is available in different grain sizes:
- PA80 (0-80 µm paste dot)
- PRA 170 (0-170 µm double dot)
이용 가능 지역
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전 세계
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TDS
| 가공 공정 | 분산, 페이스트, 더블 닷 |
| 용융부피지수(MVR) (cm3/10min) | 41.5 |
| 용융 온도 (°C) (DSC, 10°C/min) | 124 |